Thursday, 30th June 2005 (4944 views)

One of the largest manufacturers of lead frames in the semiconductor industry has signed a deal with Samsung for its Micro PPF (pre plated frame) technology.

The deal will allow Dynacraft to offer customers nickel-palladium-gold alloy pre-plated lead frames, with a plating thickness of 0.1 micro-inch minimum.

Such plating typically has a 0.8 micro-inch minimum.

Iain Meikle, Dynacraft's chief operating officer, claimed the deal would triple its plating capacity and strengthen the company's ability to support customer demand for lead-free products.

The plating technology provides more cost effective for lead-free requirements and cuts the assembly cycle time.

In addition the improved process offers a higher level of quality and product reliability.

The technology will be transferred and installed by both firms into Dynacraft in Malaysia, by the end of this year.

 

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